Overview
Agent and edge AI computing architectures and chiplet inference chips
Funding
Amounts as reported; USD estimates shown only when they matchListed 3 funding records. Latest funding: RMB 700M (Series A), Jul 27, 2026.
1 listed record lack a clear date or positive USD estimate for the chart.
| Date | Amount | Investors | Sources |
|---|---|---|---|
| Jul 27, 2026 | RMB 700M ≈ $100M · Series A | IDG Capital, 一维创投, 九安医疗, 仁爱礼恒（天津）创业投资合伙企业（有限合伙）, 北京英诺未来科技创业投资基金合伙企业（有限合伙）, 天津海棠智启创业投资合伙企业（有限合伙）, 天津绿茵景观生态建设股份有限公司, 武岳峰科创, 汤臣倍健股份有限公司 | No source link |
Evidence Yuanli Semiconductor completes RMB 700 million in Series A financingOn 2026/7/27, Xiniu Data reported that Yuanli Semiconductor completed RMB 700 million in Series A financing. Investors included Jiuan Medical, By-Health Co., Ltd., Tianjin Lvyin Landscape and Ecology Construction Co., Ltd., Tianjin Haitang Zhiqi Venture Capital Partnership (Limited Partnership), Renai Liheng (Tianjin) Venture Capital Partnership (Limited Partnership), IDG Capital, Wuyuefeng Kechuang, Beijing Inno Future Technology Venture Capital Fund Partnership (Limited Partnership), Yiwei Venture Capital and others. The company develops modular AI Chiplet computing chips. Translated source brief, not a quotation. Check the original before citing. Sources · 0
IDG Capital, 一维创投, 九安医疗, 仁爱礼恒（天津）创业投资合伙企业（有限合伙）, 北京英诺未来科技创业投资基金合伙企业（有限合伙）, 天津海棠智启创业投资合伙企业（有限合伙）, 天津绿茵景观生态建设股份有限公司, 武岳峰科创, 汤臣倍健股份有限公司 | |||
| Apr 4, 2026 | RMB 500M ≈ $71.4M · Pre-Series A | IDG Capital, 一维创投, 中科创星, 北京首发展玉衡一期创业投资中心, 国新基金, 尚势资本, 常州武岳峰仟朗二期半导体产业投资基金合伙企业, 广州红鸟启航创业投资合伙企业（有限合伙）, 水木清华校友种子基金, 英诺基金, 领屹基金, 香港木棉花基金 | No source link |
Evidence Yuanli Semiconductor raises RMB 500 million in Pre-Series A financingOn 2026-04-04, according to Xiniu Data, Yuanli Semiconductor completed Pre-Series A financing, raising RMB 500 million. Investors were lead investor IDG Capital, Changzhouwuyuefengqianlang Phase Two Semiconductor Industrial Investment Fund Partnership (Limited Partnership), Guoxin Fund, Shangshi Capital and others. The company is a developer of modular AI Chiplet computing chips. Translated source brief, not a quotation. Check the original before citing. Sources · 0
IDG Capital, 一维创投, 中科创星, 北京首发展玉衡一期创业投资中心, 国新基金, 尚势资本, 常州武岳峰仟朗二期半导体产业投资基金合伙企业, 广州红鸟启航创业投资合伙企业（有限合伙）, 水木清华校友种子基金, 英诺基金, 领屹基金, 香港木棉花基金 | |||
| Nov 2, 2025 | Undisclosed · Equity | 九尚资本, 源石基金, 琢石投资, 英诺天使基金, 领屹基金, 首都科技发展集团, 鸿亚投资 | No source link |
Select ▸ on a row to see its source brief and links.
Valuation
Amounts as reported; USD estimates shown only when they matchListed 3 valuation records.
No chartable valuation estimates yet.
3 listed records lack a clear date or positive USD estimate for the chart.
| Date | Amount | Investors | Sources |
|---|---|---|---|
| Jul 27, 2026 | — · Series A | IDG Capital, 一维创投, 九安医疗, 仁爱礼恒（天津）创业投资合伙企业（有限合伙）, 北京英诺未来科技创业投资基金合伙企业（有限合伙）, 天津海棠智启创业投资合伙企业（有限合伙）, 天津绿茵景观生态建设股份有限公司, 武岳峰科创, 汤臣倍健股份有限公司 | No source link |
Evidence Yuanli Semiconductor completes RMB 700 million in Series A financingOn 2026/7/27, Xiniu Data reported that Yuanli Semiconductor completed RMB 700 million in Series A financing. Investors included Jiuan Medical, By-Health Co., Ltd., Tianjin Lvyin Landscape and Ecology Construction Co., Ltd., Tianjin Haitang Zhiqi Venture Capital Partnership (Limited Partnership), Renai Liheng (Tianjin) Venture Capital Partnership (Limited Partnership), IDG Capital, Wuyuefeng Kechuang, Beijing Inno Future Technology Venture Capital Fund Partnership (Limited Partnership), Yiwei Venture Capital and others. The company develops modular AI Chiplet computing chips. Translated source brief, not a quotation. Check the original before citing. Sources · 0
IDG Capital, 一维创投, 九安医疗, 仁爱礼恒（天津）创业投资合伙企业（有限合伙）, 北京英诺未来科技创业投资基金合伙企业（有限合伙）, 天津海棠智启创业投资合伙企业（有限合伙）, 天津绿茵景观生态建设股份有限公司, 武岳峰科创, 汤臣倍健股份有限公司 | |||
| Apr 4, 2026 | — · Pre-Series A | IDG Capital, 一维创投, 中科创星, 北京首发展玉衡一期创业投资中心, 国新基金, 尚势资本, 常州武岳峰仟朗二期半导体产业投资基金合伙企业, 广州红鸟启航创业投资合伙企业（有限合伙）, 水木清华校友种子基金, 英诺基金, 领屹基金, 香港木棉花基金 | No source link |
Evidence Yuanli Semiconductor raises RMB 500 million in Pre-Series A financingOn 2026-04-04, according to Xiniu Data, Yuanli Semiconductor completed Pre-Series A financing, raising RMB 500 million. Investors were lead investor IDG Capital, Changzhouwuyuefengqianlang Phase Two Semiconductor Industrial Investment Fund Partnership (Limited Partnership), Guoxin Fund, Shangshi Capital and others. The company is a developer of modular AI Chiplet computing chips. Translated source brief, not a quotation. Check the original before citing. Sources · 0
IDG Capital, 一维创投, 中科创星, 北京首发展玉衡一期创业投资中心, 国新基金, 尚势资本, 常州武岳峰仟朗二期半导体产业投资基金合伙企业, 广州红鸟启航创业投资合伙企业（有限合伙）, 水木清华校友种子基金, 英诺基金, 领屹基金, 香港木棉花基金 | |||
| Nov 2, 2025 | — · Equity | 九尚资本, 源石基金, 琢石投资, 英诺天使基金, 领屹基金, 首都科技发展集团, 鸿亚投资 | No source link |
Select ▸ on a row to see its source brief and links.
Revenue
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Team, products & investors
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Sources · 0Sources & provenance
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Agent与端侧AI计算架构、Chiplet推理芯片