News brief
On 2026/7/27, Xiniu Data reported that Yuanli Semiconductor completed RMB 700 million in Series A financing. Investors included Jiuan Medical, By-Health Co., Ltd., Tianjin Lvyin Landscape and Ecology Construction Co., Ltd., Tianjin Haitang Zhiqi Venture Capital Partnership (Limited Partnership), Renai Liheng (Tianjin) Venture Capital Partnership (Limited Partnership), IDG Capital, Wuyuefeng Kechuang, Beijing Inno Future Technology Venture Capital Fund Partnership (Limited Partnership), Yiwei Venture Capital and others. The company develops modular AI Chiplet computing chips.
Connected profiles
Explore
Sources · 0Sources & provenance
English text is maintained separately from the original record. Consult the original source before citing a fact.
No source links are available for this profile.
Original source text
Names may use phonetic renderings when no English name is supplied. The original wording is retained below.
2026年7月27日，据烯牛数据报道，原粒半导体完成A轮融资，金额7亿人民币。投资方为九安医疗，汤臣倍健股份有限公司，天津绿茵景观生态建设股份有限公司，天津海棠智启创业投资合伙企业（有限合伙），仁爱礼恒（天津）创业投资合伙企业（有限合伙），IDG资本，武岳峰科创，北京英诺未来科技创业投资基金合伙企业（有限合伙），一维创投等。该公司为AI Chiplet积木式算力芯片研发商。