News brief
On 2026-04-04, according to Xiniu Data, Yuanli Semiconductor completed Pre-Series A financing, raising RMB 500 million. Investors were lead investor IDG Capital, Changzhouwuyuefengqianlang Phase Two Semiconductor Industrial Investment Fund Partnership (Limited Partnership), Guoxin Fund, Shangshi Capital and others. The company is a developer of modular AI Chiplet computing chips.
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2026年4月4日，据烯牛数据报道，原粒半导体完成Pre-A轮融资，金额5亿人民币。投资方为IDG资本领投、常州武岳峰仟朗二期半导体产业投资基金合伙企业（有限合伙）、国新基金、尚势资本等。该公司为AI Chiplet积木式算力芯片研发商。