News
Company news and developments, with original sources and dates.
Updated from source
Funding RSS ↗Zhipu Completes RMB 20.14B Convertible Bond Issuance
On September 18, 2026, Zhipu (Z.AI) completed a USD-settled zero-coupon convertible bond issuance with RMB 20.14 billion in principal (approximately USD 3.016 billion gross), due 2027, with subscribers undisclosed, as disclosed to HKEX.
Z.AI raises $5B through shares and convertible bonds
On 2026/9/14, The Standard reported that Chinese AI company Z.AI raised USD 5 billion through new shares and convertible bonds. Founded by AI researchers, the company will use the funding to expand computing capacity and model research and development.
MiniMax completes approximately HKD 16 billion new-share placement and convertible bond funding, underwritten by Morgan Stanley
On 2026/7/10, Cailian Press and Zhidx reported that AI large-model company MiniMax, also known as Xiyu Technology (0100.HK), had announced financing after listing on the Hong Kong main board in month 1 that year. It proposed placing 35.6 million new Class A shares at HKD 268 per share, raising approximately HKD 9.54 billion gross, while issuing HKD 6.5 billion principal of zero-coupon guaranteed convertible bonds due in 2027. The initial conversion price was HKD 335 per share, approximately 12.64% above the closing price. Combined net proceeds were approximately HKD 15.957 billion, approximately 13.8 billion yuan (CNY) or approximately USD 2 billion. Morgan Stanley underwrote the transaction, attracting leading international sovereign funds, long-term funds and major Chinese institutions. Approximately 80% of funds would support AI infrastructure and large-model R&D. This was MiniMax’s first large-scale financing after listing.
Yanrongyun completes equity financing; amount undisclosed
On 2026/7/6, Xiniu Data reported that Yanrongyun completed equity financing for an undisclosed amount. The investor was Ningbo Meishan Bonded Port Area Fengnian Haorui Investment Management Co., Ltd. The company provides AI storage solutions.
NVIDIA plans at least USD 20 billion bond issuance
On 2026/6/15, The Decoder reported that US chip giant NVIDIA planned to raise at least USD 20 billion through its first bond issuance since 2021, joining the wave of AI infrastructure debt financing.
Suno AI raises USD 400 million in Series D financing
On 2026-06-04, according to Xiniu Data, Suno AI completed Series D financing, raising USD 400 million. Investors were lead investor Bond Capital, participating investor IVP, participating investor Forerunner, participating investor Union Square Ventures, participating investor Alkeon, participating investor Quiet, participating investor Matrix, participating investor Lightspeed, participating investor Menlo Ventures, participating investor Schroders Capital. The company is a provider of solutions for U.S. AI music generation.
Bondu raises USD 5.3 million in seed financing
Brief not available.
BondIT raises USD 14 million in strategic financing
Brief not available.