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On September 9, 2026, Hangzhou-based Weina Hexin, a 3D compute-in-memory AI chip developer, raised RMB 1 billion in a C1 round backed by US-China Capital, Yuanhao Investment, Jinpu Investment, Sunshine Life and Oriza Puhua.
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- www.cnstock.com ↗Published Sep 9, 2026
Original source text
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2026年9月9日，据上海证券报报道，杭州三维存算一体AI芯片研发商微纳核芯完成10亿元人民币C1轮融资，优势资本、元昊投资、金浦投资、阳光人寿、元禾璞华等参与。公司面向存算一体AI芯片。