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Siminwei Integrated Circuits raises RMB 100 million in seed financing

News
Stable identifier
6767cbcb-8b8f-488b-ab75-883cf4ef8b83
News date
May 6, 2026
Funding estimate
RMB 100M
Consideration (USD)
—
Source record updated
Oct 16, 2026
Snapshot captured
Oct 20, 2026
English updated
Oct 21, 2026
Original title

思敏威集成电路完成种子轮融资,金额1亿人民币

Translation dates do not change the dates of the underlying facts.

News brief

On 2026-5-6, according to Xiniu Data, Siminwei Integrated Circuits completed seed financing, raising RMB 100 million. Investors were Dongfangfuhai, Jiyuan Capital, Xuhui Capital, Detong Capital and others.

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Original source text

Names may use phonetic renderings when no English name is supplied. The original wording is retained below.

2026年5月6日,据烯牛数据报道,思敏威集成电路完成种子轮融资,金额1亿人民币。投资方为东方富海、纪源资本领投、徐汇资本、德同资本等。该公司为AI推理架构平台解决方案提供商。