Skip to content
UniqueBaseEN
For AI ↗
News

Reexen raises RMB 200 million in Series B+ financing

News brief

On 2026-04-22, according to Xiniu Data, Reexen completed Series B+ financing, raising RMB 200 million. Investors were Haowei Integrated Circuits (Group) Co., Ltd., Anhui Jiaokongzhaoshang Information Xinjijian Private Fund Partnership (Limited Partnership), Gongdadiansheng, Suzhou Yinghaoxinneng Venture Capital Partnership (Limited Partnership) and others. The company is a developer of integrated sensing, storage and computing chips.

Connected profiles

Explore

Sources · 0

Sources & provenance

English text is maintained separately from the original record. Consult the original source before citing a fact.

No source links are available for this profile.

Original source text

Names may use phonetic renderings when no English name is supplied. The original wording is retained below.

2026年4月22日,据烯牛数据报道,九天睿芯完成B+融资,金额2亿人民币。投资方为豪威集成电路(集团)股份有限公司、安徽交控招商信息新基建私募基金合伙企业(有限合伙)、共达电声、苏州英豪芯能创业投资合伙企业(有限合伙)等。该公司为感存算一体芯片研发商。