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Skyfly Technologies completes seed round of funding in the amount of USD 10 million

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News
Stable identifier
1e226194-4a9c-45d2-8c79-2f2d262153c7
News date
Oct 20, 2026
Funding estimate
$10
Consideration (USD)
—
Source record updated
Oct 24, 2026
Snapshot captured
Oct 25, 2026
English updated
Oct 25, 2026
Original title

Skyfly Technologies完成种子轮融资,金额1000万美元

Translation dates do not change the dates of the underlying facts.

News brief

According to Fireround, Skyfly Technologies has completed a new round of financing amounting to $10 million, this round is a seed round, and the investors include Hico (leading investment).

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Sources · 1

Sources & provenance

English text is maintained separately from the original record. Consult the original source before citing a fact.

  1. skyfly.aero ↗Published Oct 20, 2026
Original source text

Names may use phonetic renderings when no English name is supplied. The original wording is retained below.

据Fireround报道,Skyfly Technologies完成新一轮融资,融资金额$10 million,本轮为种子轮,投资方包括HICO(领投)。