{"id":"1ce75d70-e22c-47b7-aa12-d225f180f549","kind":"news","code":"1ce75d70-e22c-47b7-aa12-d225f180f549","name":"Xinmeng Technology completes equity financing","nameBasis":"translated-title","summary":"On 2026-03-17, according to Xiniu Data, Xinmeng Technology completed equity financing for an undisclosed amount. Investors were Zhongxinjuyuan.","description":"","country":null,"category":null,"originalName":"芯盟科技完成股权投资融资","eventDate":"2026-03-17T00:00:00.000Z","website":null,"sourceUpdatedAt":"2026-10-18T17:28:17.305Z","englishUpdatedAt":"2026-10-20T18:31:06.406Z","reviewedAt":"2026-10-20T18:31:06.406Z","snapshotAt":"2026-10-20T18:19:32.670Z","sourceHash":"9ccd1c3a6efe348629198799e6f941f24acd8c87b52f4a2084a33628179c65d4","companyId":"445eeaf3-d579-47e0-83d8-d0a14ea7ff64","foundedYear":null,"logoUrl":null,"transactionConsiderationUsd":null,"considerationLabel":null,"amountEstimateUsd":null,"fundingEstimateUsd":null,"fundingEstimateLabel":"Undisclosed","originalText":"2026年3月17日，据烯牛数据报道，芯盟科技完成股权投资融资，金额未披露。投资方为中芯聚源。","sources":[],"related":[{"id":"445eeaf3-d579-47e0-83d8-d0a14ea7ff64","kind":"companies","code":"UB-C10896","name":"Xinmeng Technology","nameBasis":"transliterated","summary":"Developer of three-dimensional heterogeneous integrated chips.","description":"","country":"China","category":null,"originalName":"芯盟科技","eventDate":null,"website":null,"sourceUpdatedAt":"2026-10-15T00:00:00.000Z","englishUpdatedAt":"2026-10-22T00:56:41.099Z","reviewedAt":"2026-10-22T00:56:41.099Z","snapshotAt":"2026-10-22T00:45:51.500Z","sourceHash":"c27abaea5e5ee3554f36cec36b3c61f1f09b0ab3726f37d19486130b290fc71a","companyId":null,"foundedYear":null,"logoUrl":null,"path":"/companies/UB-C10896"},{"id":"a7cf4648-21ba-4037-bbdf-32de648074d5","kind":"institutions","code":"UB-I1669","name":"Zhongxinjuyuan","nameBasis":"transliterated","summary":"An integrated circuit venture capital firm with a SMIC background.","description":"An integrated circuit venture capital firm with a SMIC background.","country":"Mainland China","category":null,"originalName":"中芯聚源","eventDate":null,"website":"https://www.cftcapital.com/","sourceUpdatedAt":"2026-10-18T23:00:20.224Z","englishUpdatedAt":"2026-10-21T16:19:07.761Z","reviewedAt":"2026-10-21T16:19:07.761Z","snapshotAt":"2026-10-20T18:10:00.657Z","sourceHash":"832f41f142a83b89cdb29e37390cf2d187d460fdcddd46bbd678fc3db909476d","companyId":null,"foundedYear":null,"logoUrl":null,"path":"/institutions/zhongxinjuyuan"}],"path":"/news/1ce75d70-e22c-47b7-aa12-d225f180f549","structured":{"city":null,"country":null,"location":null,"role":null,"category":null,"company":{"name":"Xinmeng Technology","path":"/companies/UB-C10896"}},"canonical":"https://uniquebase.ai/news/1ce75d70-e22c-47b7-aa12-d225f180f549"}