News brief
On 2026-04-04, according to Xiniu Data, Houmo completed an equity financing round for an undisclosed amount. Investors included Beijing Economic-Technological Development Area Industrial Upgrading Equity Investment Fund Phase Two (Limited Partnership) and Beijing Yitang Chuangxin Venture Capital Center (Limited Partnership). The company develops high-computing-power AI chips using computing-in-memory technology.
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2026年4月4日，据烯牛数据报道，后摩智能完成股权投资融资，金额未披露。投资方为北京经济技术开发区产业升级股权投资基金二期（有限合伙）、北京屹唐创欣创业投资中心（有限合伙）。该公司为存算一体大算力AI芯片研发商。