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Biren Technology

A general-purpose intelligent chip designer

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Snapshot

As of Oct 15, 2026, UniqueBase lists 3 funding records for Biren Technology; the latest is RMB 2B (Strategic) on Dec 6, 2023.

Funding records
3
Latest round
RMB 2B · Strategic
Total raised (reported)
—
Rows with a source link
0 of 3

Overview

Biren Technology designs general-purpose intelligent chips.

Funding · 3

Funding

Amounts as reported; USD estimates shown only when they match

Listed 3 funding records. Latest funding: RMB 2B (Strategic), Dec 6, 2023.

Annual trendUnit: USD
2023$286MDec 6, 2023: $286M · Strategic

2 listed records lack a clear date or positive USD estimate for the chart.

DateAmountInvestorsSources
Mar 11, 2025Hundreds of millions · Strategic上海国投 No source link
Dec 6, 2023RMB 2B ≈ $286M · Strategic未披露 No source link
Jan 13, 2022Undisclosed · Strategic瑞誉股权 No source link

Select ▸ on a row to see its source brief and links.

Valuation · 3

Valuation

Amounts as reported; USD estimates shown only when they match

Listed 3 valuation records.

Annual trendUnit: USD

No chartable valuation estimates yet.

3 listed records lack a clear date or positive USD estimate for the chart.

DateAmountInvestorsSources
Mar 11, 2025— · Strategic上海国投 No source link
Dec 6, 2023— · Strategic未披露 No source link
Jan 13, 2022— · Strategic瑞誉股权 No source link

Select ▸ on a row to see its source brief and links.

Revenue · 1

Revenue

Amounts as reported; USD estimates shown only when they match

Listed 1 revenue record.

Annual trendUnit: USD

No chartable revenue estimates yet.

1 listed record lack a clear date or positive USD estimate for the chart.

Revenue dateAmountSources
Jun 30, 2026RMB 1.24B 1 source Source ↗

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Team, products & investors

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Sources · 0

Sources & provenance

English text is maintained separately from the original record. Consult the original source before citing a fact.

No source links are available for this profile.

Original source text

Names may use phonetic renderings when no English name is supplied. The original wording is retained below.

通用智能芯片设计商 壁仞科技是一家通用智能芯片设计商